Tower Semiconductor History
1993 – Tower Semiconductor Founded
Tower Semiconductor was founded in 1993, with the acquisition of National Semiconductor’s 150mm wafer fabrication facility in Migdal Haemek, Israel.
1994 – NASDAQ: TSEM
Tower Semiconductor became a public company in 1994.
2000 – Worldwide Design Center
In 2000, Tower established its worldwide design center.
Design it once, design it right!
2001 – TSEM on Tel Aviv Stock Exchange
Tower Semiconductor shares began to be traded on Tel Aviv Stock Exchange (TASE: TSEM) in 2001.
2004 – Foundation of Fab 2
Tower Semiconductor established an adjacent, state-of-the-art facility (Fab 2) in Migdal Haemek Israel, designed to operate in geometries of 0.18-micron and below, using advanced CMOS technology.
2008 – TowerJazz: Tower Semiconductor and Jazz Semiconductor Merge
Tower Semiconductor and Jazz Semiconductor merged in a stock-for-stock transaction and the combined companies officially launched as TowerJazz. The merger provided several key benefits: increased global capacity, a larger customer base, a more comprehensive product portfolio, and a stronger financial base.
2014 – TowerJazz Panasonic Semiconductor Co. (TPSCo)
In 2014, TowerJazz completed a joint venture with Panasonic Corporation enabling TowerJazz to offer its customers state-of-the-art 300mm technology including best-of-class 65nm CMOS image sensor dark current and quantum efficiency performance and additional 45nm digital technology, adding available capacity of approximately 800,000 wafers per year (8 inch equivalent) in the manufacturing facilities in Japan.
2016 – Acquisition of Maxim Integrated 8” Facility in Texas
In 2016, in order to support the company’s strong customer demand and to enable additional manufacturing flexibility, TowerJazz acquired Maxim Integrated’s 8-inch wafer fabrication facility in San Antonio, Texas, United States, cost-effectively increasing production by approximately 28,000 wafers per month.
2020 – Rebranding
In 2020, launched a new brand identity to reflect the Company’s global presence and strength, and highlight its focus to provide the highest value analog semiconductor solutions. The new brand identity included updates to Company’s brand name, vision, mission, values, logo, tagline, website, and graphic design approach.
2021 – Partnership with ST Microelectronics in Agrate, Italy
In 2021, Tower announced a partnership with ST Microelectronics to accelerate the Agrate, Italy 300mm analog and power fab capacity.
2023 – Capacity Agreement with IFS in New Mexico 300mm Facility
In 2023, Intel Foundry Services (IFS) and Tower announced an agreement where Intel will provide foundry services and 300mm manufacturing capacity to help Tower serve its customers globally. Under the agreement, Tower will utilize Intel’s advanced manufacturing facility in New Mexico.
Tower Semiconductor was founded in 1993, with the acquisition of National Semiconductor’s 150mm wafer fabrication facility in Migdal Haemek, Israel. Tower became a public company in 1994. In 2001, Fab 2, a 200mm facility, was constructed alongside Fab 1.
In 2008, Tower acquired Jazz Semiconductor’s 200mm facility (Fab 3) which increased global capacity, offered a more comprehensive technology portfolio, a larger customer base, and a stronger financial base.
In 2014, TowerJazz completed a joint venture with Panasonic Corporation enabling TowerJazz to offer its customers state of the art 300mm technology including best of class 65nm CMOS image sensor dark current and quantum efficiency performance and additional 45nm digital technology, adding available capacity of approximately 800,000 wafers per year (8 inch equivalent) in three manufacturing facilities in Japan.
In 2016, in order to support the company’s strong customer demand and to enable additional manufacturing flexibility, TowerJazz acquired Maxim Integrated’s 8-inch wafer fabrication facility in San Antonio, Texas, United States, cost-effectively increasing production by approximately 28,000 wafers per month.
In 2020, launched a new brand identity to reflect the Company’s global presence and strength, and highlight its focus to provide the highest value analog semiconductor solutions. The new brand identity included updates to Company’s brand name, vision, mission, values, logo, tagline, website, and graphic design approach.
In 2021, Tower announced a partnership with ST Microelectronics to accelerate the Agrate, Italy 300mm analog and power fab capacity.
In 2023, Intel Foundry Services (IFS) and Tower announced an agreement where Intel will provide foundry services and 300mm manufacturing capacity to help Tower serve its customers globally. Under the agreement, Tower will utilize Intel’s advanced manufacturing facility in New Mexico.