Tower Semiconductor provides global capacity assurance with high quality and flexible worldwide manufacturing capabilities, enabling multi-fab wafer production options in three geographic regions, serving fabless companies as well as IDMs. The Company is continuously looking to increase wafer capacity in its existing or additional geographic locations.
Tower Semiconductor offers high quality manufacturing in its multiple worldwide fabrication facilities and drives operational excellence. As a global company, Tower Semiconductor has the ability to benchmark between its different fabs as well as to take advantage of the enhanced skill set within its work force to share the best qualities and capabilities from each group across the entire organization. In this way, Tower Semiconductor is continuously improving its operational performance, manufacturing quality, and corporate cost structure. These activities allow Tower Semiconductor to better serve its customers and achieve improved financial corporate performance.
Migdal Haemek, Israel
- 6-inch (150mm)
- CMOS, CIS, Power, Power Discrete
- 1µm to 0.35µm
- Planarized BEOL, W and Oxide CMP
Migdal Haemek, Israel
- 8-inch (200mm)
- CMOS, CIS, Power, Power Discrete, RF Analog, MEMS
- 0.18µm to 0.13µm
- Cu and Al BEOL, EPI, 193nm Scanner
Agrate, Italy
- 12-inch (300mm)
- Analog RF, Power, Displays
- 65nm
Newport Beach, CA, USA
- 8 inch (200mm)
- CMOS, CIS, RF Analog, MEMS
- 0.18µm to 0.13µm
- Al BEOL, SiGe, EPI
San Antonio, TX, USA
- 8-inch (200mm)
- Power, RF Analog
- 0.18µm
- Al BEOL
TPSCo – Tower and NTCJ partnership
TPSCo was established in 2014. The company is 51% owned by Tower Semiconductor, Ltd. (NASDAQ: TSEM, TASE: TSEM) and 49% owned by Nuvoton Technology Corporation Japan . TPSCo’s fabs in Hokuriku, Japan have been manufacturing large scale integrated circuits (ICs) for over 35 years and more than 750 million ICs for automotive products (Grade 0, 1 & 2) have been produced.
For more information visit: https://towersemi.com/tpsco/
Tonami, Japan
- 8-inch (200mm)
- Analog, Power Discrete, NVM, CCD
- 0.35µm to 0.15µm
Uozu, Japan
- 12-inch (300mm)
- Analog, CMOS, CIS, RFCMOS/ SOI
- 65nm & 45nm
Arai, Japan
- 8-inch (200mm)
- Analog, CIS
- 0.13µm to 0.11µm