Process Technology Offerings
Tower Semiconductor offers a broad range of advanced analog process technologies tailored to meet its customers’ precise specifications enabling the most cost-effective and versatile IC manufacturing solutions.
The Company’s specialty technology offerings include: SiGe BiCMOS and RF CMOS (SOI and bulk) for radio frequency (RF) and high performance analog (HPA) applications; CMOS image sensor (CIS); power management, including 700V BCD; CMOS; Mixed-Signal CMOS and MEMS capabilities.
Tower Semiconductor’s modular and customizable processes are available on either 150mm, 200mm or 300mm wafers in its seven world-class fabrication facilities located in Israel, US and Japan, which have achieved quality certifications for environmental management, health & safety, information security, and automotive standards.
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To complement its sophisticated technology offerings, Tower Semiconductor provides a world-class design enablement platform that facilitates a quick and accurate design cycle. The Company’s IP portfolio includes 3rd party IPs as well as our internal solutions.
In addition, Tower Semiconductor provides Transfer Optimization and development Process Services (TOPS) to IDMs and fabless companies that need to expand capacity. The Company offers multi-fab sourcing with two manufacturing facilities in Israel, two in the U.S., and three in Japan through a joint venture with Panasonic Corporation TPSCo.