Micro-Electro-Mechanical Systems (MEMS)
Providing world class “Foundry MEMS enablement” solutions to address the complex needs of wireless and consumer electronics markets
Tower Semiconductor offers global high-volume MEMS manufacturing solutions to enable applications such as high-end accelerometers, gyro, oscillators, power management controllers (ASIC), audio sensors and actuators, radio frequency MEMS tuners, infra-red pixel array sensors and on drive and control chips (companion CMOS chips).
Tower Semiconductor’s MEMS capabilities target high performance antenna tuning and switching for mobile wireless, infrared measurement for sensor devices in consumer imaging, security, automotive, industrial, and military applications.
Focused on a collaborative partnership model and applying its foundry experience, Tower Semiconductor offers silicon MEMS processes and a customer-oriented team, enhancing its customers’ ability to create and bring to market more highly integrated analog products.
MEMS Foundry Capabilities
Tower Semiconductor works with top tier established companies, as well as start-ups, to bring new technologies from idea to volume production, with over 15 years of high volume MEMS manufacturing capabilities, in its worldwide 150mm, 200mm and 300mm manufacturing facilities.
Wafer Process Capabilities:
Multiple Systems and fabs with Deep Si, deep oxide, thick metal etches
- Deep trench isolation
- Si MEMS on SOI <1μm, 10 – 20μm
- Deeper etches (> 100μm)
- Thick metal, deep via, TSV
Multiple Tools and methods:
- Dielectrics, polymers, group IV materials (e.g. Si)
- Gas or vapor methods
- CMOS + MEMS
- BiCMOS + MEMS
- HVCMOS + MEMS
- Glass substrates
Wafer level packaging or thin film seal
- Methods for Si MEMS and RF MEMS
- ISO standards
- CMOS manufacturing line disciplines for MEMS
Control Chip Technology
- ASIC, ROIC, Controller…
- CMOS for charge pumps