Tower Semiconductor History
Tower Semiconductor was founded in 1993, with the acquisition of National Semiconductor’s 150mm wafer fabrication facility in Migdal Haemek, Israel. Tower became a public company in 1994. In 2001, Fab 2, a 200mm facility, was constructed alongside Fab 1.
In 2008, Tower acquired Jazz Semiconductor’s 200mm facility (Fab 3) which increased global capacity, offered a more comprehensive technology portfolio, a larger customer base, and a stronger financial base.
In 2014, TowerJazz completed a joint venture with Panasonic Corporation enabling TowerJazz to offer its customers state of the art 300mm technology including best of class 65nm CMOS image sensor dark current and quantum efficiency performance and additional 45nm digital technology, adding available capacity of approximately 800,000 wafers per year (8 inch equivalent) in three manufacturing facilities in Japan.
In 2016, in order to support the company’s strong customer demand and to enable additional manufacturing flexibility, TowerJazz acquired Maxim Integrated’s 8-inch wafer fabrication facility in San Antonio, Texas, United States, cost-effectively increasing production by approximately 28,000 wafers per month.
In 2020, launched a new brand identity to reflect the Company’s global presence and strength, and highlight its focus to provide the highest value analog semiconductor solutions. The new brand identity included updates to Company’s brand name, vision, mission, values, logo, tagline, website, and graphic design approach.
In 2021, Tower announced a partnership with ST Microelectronics to accelerate the Agrate, Italy 300mm analog and power fab capacity.
In 2023, Intel Foundry Services (IFS) and Tower announced an agreement where Intel will provide foundry services and 300mm manufacturing capacity to help Tower serve its customers globally. Under the agreement, Tower will utilize Intel’s advanced manufacturing facility in New Mexico.