MEMS and Non-imaging Sensors Technology
November 19, 2020 |
This session will provide an overview of Tower’s MEMS technology and manufacturing experience at its global facilities, emphasizing strengths at each technology platform F3: integrated CMOS + MEMS; F2:Bulk micromachining, membranes.
Available process capabilities. We will discuss various examples of development done, and show products that are/have been in production
We will also cover our roadmap to expand our MEMS programs with new partners and collaborators.
Non-Imaging Sensors – Creating SoC edge node devices combining CMOS and sensors
Miniaturized low-cost/low-power semiconductor sensors are critical in numerous emerging applications, in particular advanced smartphones, automotive electronics, edge IoT devices and medical systems. Tower Semiconductor offers production platforms that allow fabricating various non-imaging sensors without, or with just a few additional masks to the core CMOS. Several examples of such platforms are presented in the talk. Special attention is given to Alpha particle (Radon) matrix detectors, comprising of large amount of pixels and featuring novel registration principles. Silicon based, UV blind sensors and IR thermometers are presented as examples of integrated products fabricated together with CMOS on SOI substrates with thin device layers. Sensing devices with open surfaces (electrostatically controlled nanowires), confirm feasibility of SOI platforms for gas sensing. TMR magnetic field sensors in the back end of 65nm CMOS process is another example of cost-efficient integration of sensing devices with CMOS.
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Mrs. Myriam Buchbinder
Senior Director of Process Engineering Research & Development
Myriam received her BSc degree in Electrical Engineering in 1984 from Concordia University, Montreal, Canada