Best-in-class Differentiated Solutions for Tomorrow’s Automobiles
Starting from motor controllers and drivers to LED headlights and LiDAR to 48V power architecture in new cars,Tower Semiconductor is supporting leading automotive customers with its differentiated technologies to efficiently electrify tomorrow’s automobiles.
- 0.18μm Bulk BCD: Tower Semiconductor offers the leading edge 0.18μm Bipolar-CMOS-DMOS (BCD) platform with the richest mature and modular power management foundry technologies available today with a common PDK, offering multiple isolation schemes and scalable LDMOS to deliver the lowest Rdson values across a wide range of voltages ranging from 1.8V up to 140V on bulk CMOS wafers. This platform is ideally suited for 12V / 48V battery operation and various DC-to-DC converters and PMIC applications. For more advanced ECUs, the TS18PM platform offers high integration capabilities using dense digital libraries with a large portfolio of memories, both OTP and MTP.
- 0.18μm SOI:Tower Semiconductor offers a 200V SOI technology platform that supports up to 120V operation, with isolated 1.8/5V CMOS and 6V to 42V scalable LDMOS, 64bit eNVM, poly eFuse and other analog components. This platform offers exceptional area savings and is well-suited for high temperature operation.
- 65nm BCD: Tower Semiconductor’s 65nm 5V and 1.2V/5V BCD platform offers the lowest Rdson and exceptional die area savings and is ideally suited for multiple secondary PMIC applications in automotive power management. This platform supports up to 16V operation and is offered in its 300mm fab in Uozu, Japan.
Tower Semiconductor has qualified major 200mm power management flows in at least two geographically distinct production sites to ensure customers of supply and capacity flexibility at all times.
Over 35 years of automotive production experience with over 750 million ICs shipped
Best-in-class Rdson BCD Platform for cost sensitive low/mid voltage applications
Differentiated high-voltage bulk and SOI offerings for 12V/48V battery voltages
Embedded digital logic and 32 – 256 Kbit eNVM
Advanced feature-rich PDK and ESD supporting ISO26262 needs