AI, ISPs and DVS
Image sensor solutions for advanced digital integration
PLATFORM FEATURES:
- Most versatile Sensor-on-digital stacking offer with in-house process or third party logic wafers
- High density pixel-to-digital Cu-to-Cu connectivity
- High sensitivity rolling and global shutter pixels, stacking-ready
- Low noise, low latency Transfer gates for High speed signal processing
- 12’’ wafer mass production grade stacking for large volumes
- • Supporting AI based augmented reality with dedicated stacked image sensors
Markets Served
Augmented Reality (AR)
Face Recognition
3D Gestures
