The latest high-voltage and high-power technologies
November 10, 2020 |
*Session in Japanese by Akira Takeishi
Addressing the continuously growing needs for advanced power performance in the computing, industrial and consumer markets, we have released our best-in-class Gen6 platform with industry-leading Rdson. Tower’s Gen6 technology includes an enhanced operation conditions to guarantee a robust operation at high currents that can create large voltage stress on a device within a switched mode applications. The advanced 65nm BCD on 300mm offers a complementary solution with the best Rdson together with ultra-high digital density and all at a lowest mask count serving applications up to 24V operation and high power needs. The high voltage solution that we provide covers up to 125V operation on a bulk technology with floating capabilities on all devices to the full voltage rail. During this session we will present Tower’s RESURF technology, including the upcoming DTI and voltage extension that will allow our customers to use all the products up to 160V with the same TS18PM technology as well as the 200V SOI technology, all sharing same PDK. Following the trend to drive GaN and SiC, as well as include multiple power domains, we will show our galvanic capacitor technology that is planned to be released next year.
In this session we will cover all technologies in detail with relevant key parameters and design tips from a device point of few including device selection, Isolation scheme and ESD. We welcome technology experts, operation team and marketing managers to partner with us on these innovative technologies.
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Mr. Erez Sarig
Director of Power Management Business Development & Marketing
Erez Sarig was appointed Director of Business Development & Marketing in 2016 after serving as Director of Europe Sales from 2014 to 2016. From 2007 until 2014 he managed the Design team in Tower Semiconductor’s design center after serving 6 years as an analog design expert… Read More »