Stacking BSI Technology, iToF and dTOF for Face Recognition and Next-Generation Global Shutter Technology
Followed by a joint presentation with Forza on Planning and Development of a Successful CMOS Image Sensor Project
November 12, 2020 |
Japan session in Japanese by Isao Miyanaga
*Login links are accessible 15 minutes prior to the beginning of the webinar for registered guests only.
One of the most fascinating development in today’s imaging market is global shutter sensor technology with enhanced performance for end applications in both the industrial and consumer markets. Such performance is made available by Tower’s world-leading 2.5um global shutter pixel technology enabling very high shutter efficiency almost independent on light angle and with high quantum efficiency. This advanced pixel offering, combined with our newly introduced BSI stacking technology, provides the capability to design state of the art, innovative sensors that bring breakthrough solutions to the market. During this session we will present our platform for BSI devices as well as our current offering for Visible Light, Tower’s PDK, and mode of work / pixel IP support. In addition, we will discuss out platform for NIR QE enhancement, and present current enhancement and results as well as future roadmap. In addition, we will present results from three different BSI devices – iTOF, dTOF and 1” high performance sensors.
Good project planning can’t completely eliminate risk but it can help deal with surprises that inevitably arise – even with the best laid plans. This presentation will describe what makes CMOS Image Sensor development different from other mixed-signal designs and discuss how to create the cornerstone of a successful design – the Specifications document.
For more information and further details, please contact us:
Webinar View On-Demand Request
Dr. Assaf Lahav
CIS Research & Development Expert and Fellow
Dr. Lahav joined Tower Semiconductor in 2001 and became a Tower Semiconductor Fellow in 2018. He has worldwide responsibility over the Company’s CMOS image sensor (CIS) technology offering. His research is focused on low noise global shutter technology, high resolution NIR imaging and back side illumination devices. Since 2008, Dr. Lahav has worked on global shutter pixel technology and fast sensors. This work in now widely used in many cameras including Time of Flight (TOF) and structured light 3D, range cameras for automotive applications, industrial and traffic control inspection cameras… Read More »
Dr. Barmak Mansoorian
Barmak brings over 25 years in mixed-signal integrated circuit design, semiconductor device physics and device micro-fabrication with specialization in active pixel sensors (APS), infrared focal plane array technology and high-speed communication. Previous to founding Forza Silicon, Barmak was with Photobit Corporation and NASA JPL’s Advanced Imager Technology Group. Barmak holds 17 patents in image sensor design and has contributed to over 20 articles in imaging and high-speed data communication. He received his BSEE and MSEE degrees, as well as his Ph.D. in Electrical Engineering, from UC San Diego.